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He is also a certified Project Management Professional, PMP®, since 2009.So to allen roro osmanagica! On dzamija u podgorici how to stop mud nest. degrees from Nanyang Technological University in 2007, 20 respectively. in Engineering (Minerals and Materials) at Ian Wark Research Institute under University of South Australia Presidential Scholarship as well as the Master of Applied Science and Bachelor of Applied Science (Materials Engineering) with Hons.
A strong believer in giving back to community, he has served in various capacities organizing conferences such as 36-38th IEMT, ICSE (2014-2016), the 15th-20th EPTC (Singapore), as well as outreach programs at the University of Yangon. He is a regular reviewer of journal papers for more than 20 international journals. His recent review papers on sintered silver are among the top-ranked worldwide. His research interests are related to joining technologies using sintered silver for power electronics applications and surface modification using plasma technologies for biomaterials, adhesion and microfluidic applications. Before joining IMEN, he has worked as a materials engineer at multinational companies and the National University of Singapore. Siow is a Research Fellow at the Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia. Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium.Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials.
Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering.
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials.